In order to supply more and more high performance-cost products, X-Meritan keep developing new technology, if you cannot do the slicing by yourself, Slices with Diffusion Barriers would be a better option. Different heigh of slice can be accepted.
X-Meritan supplies Slices with Diffusion Barriers made from extruded ingots with thickness starting from 0.3 mm. Accuracy of cutting is ±15 microns. And special technology of multilayer diffusion barriers (Ni based alloys) onto slices is applied for preventing solder component penetration in semiconductor.
As to solderable layer over diffusion barrier protecting of diffusion barrier against oxidation and providing good quality of soldering X-Meritan proposes two variants:
- Chemical plating by tin (7 microns ± 2 microns)
- Chemical plating by gold (< 0.2 microns)
For special applications (high temperatures, or strong cycles in modules) X-Meritan is ready to recommend (patented) so-called H-technology where besides diffusion barrier made from Ni based alloys the thick layers (about 150 microns) of aluminum are introduced in multilayer barrier, see chapter Diffusion Barriers.
X-Meritan focuses on the application of advanced semiconductor cooling technology, providing professional material selection, core component supply and overall heat dissipation solution support for optical communication, industry and medical, and automotive radar. Our customer base includes system integrators in the communication industry, domestic and foreign manufacturers of optical communication devices and modules, universities and key laboratories in the field of optoelectronics, etc. Today, the markets we serve cover areas such as optical fiber communication, sensing, medical care, automotive radar and consumer goods.
We have many customers from both domestic market and oversea market.Hardy Sales managers can speak fluent English for good communication.
Europe 55%
Southeast Asia 15%
North America 15%
Other 15%
